scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class 14 microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall Identify the circuit function as follows:

Device type Generic number Circuit function 01 49FCT805 Octal buffer/clock driver with non-inverting three-state outputs, TTL compatible inputs. 02 49FCT805A Octal buffer/clock driver with non-inverting three-state outputs, TTL compatible inputs. 03 49FCT806 Octal buffer/clock driver with inverting three-state outputs, TTL compatible inputs. 04 49FCT806A Octal buffer/clock drive with inverting three-state outputs, TTL compatible inputs.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-In-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Leadless-chip-carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range (V_OUT) - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc 4/ DC input clamp current (I_IK) (V_IN = −0.5 B V dc and +7.0 V dc) - - - - - - ±20 mA DC output clamp current (I_OK) (V_OUT = −0.5 V dc and +7.0 V dc) - - - - - - ±20 mA DC output source current (I_OH) per output- - - - - - - - - - - - - - - - - −30 mA DC output sink current (I_OL) per output- - - - - - - - - - - - - - - - - - +70 mA DC V_CC current (I_CC) - - - - - - - - - - - - - - - - - - - - - - - - - - - −340 mA DC ground current (GND)- - - - - - - - - - - - - - - - - - - - - - - - - - +780 mA Storage temperature under bias (T_STG) - - - - - - - - - - - - - - - - - - −65°C to +135°C Case temperature under bias (T_BIAS)- - - - - - - - - - - - - - - - - - - - −65°C to +135°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (T_J)- - - - - - - - - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Output voltage range (V_OUT)- - - - - - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Maximum low level input voltage (V_IL)- - - - - - - - - - - - - - - - - - - 0.8 V dc Minimum high level input voltage (V_IH) - - - - - - - - - - - - - - - - - - 2.0 V dc Case operating temperature range (T_C)- - - - - - - - - - - - - - - - - - - −55°C to +125°C Maximum input rise and fall rate (t_r, t_f) maximum: (from V_IN = 0.8 V to 2.0 V, 2.0 V to 0.8 V)- - - - - - - - - - - - - - - 5 ns/V Maximum high level output current (I_OH)- - - - - - - - - - - - - - - - - - −24 mA Maximum low level output current (I_OL) - - - - - - - - - - - - - - - - - - +48 mA

intended Use: