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DLA - SMD-5962-89712

MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 8 May 1991
Status: inactive
Page Count: 15
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 45 ns 02 See 6.4 16K × 4 SRAM separate I/O 35 ns 03 25 ns 04 20 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X D-15 (28-lead, 1.485" × .310" × .230"), dual-in-line package Y F-11 (28-lead, .740" × .380" × .090"), flat package Z C-11A (28-terminal, .560" × .358" × .075"), rectangular chip carrier package U C-11 (28-terminal, .560" × .358" × .120"), rectangular chip carrier package

Supply voltage range to ground potential (VCC) - - - - - - - −0.5 V dc to +7.0 V dc DC voltage range applied to outputs in High Z state - - - - −0.5 V dc to +7.0 V dc DC input voltage range (VIN) 1/ - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC output current - - - - - - - - - - - - - - - - - - - - - 20 mA Maximum power dissipation - - - - - - - - - - - - - - - - - 1.0 W Lead temperature (soldering, 10 seconds) - - - - - - - - - - +260°C Thermal resistance, junction-to-case (θJC) - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) 2/ - - - - - - - - - - - - - - - +150°C Storage temperature range (TSTG) - - - - - - - - - - - - - - −65°C to +150°C Temperature under bias - - - - - - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage range (VCC) - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) (VSS) - - - - - - - - - - - - - - 0 V dc Input high voltage (VIH) - - - - - - - - - - - - - - - 2.2 V dc minimum Input low voltage (VIL) - - - - - - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (TC) - - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD-5962-89712 REV D
July 5, 2022
MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
SMD 5962-89712
November 5, 2015
MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD 5962-89712
June 5, 2007
MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-89712 REV A
May 4, 1999
MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-89712
May 8, 1991
MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 16K X 4 BITS SRAM, (STD POWER), MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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