DS/EN 62326-4
Printed boards - Part 4: Rigid multilayer boards with interlayer connections - Sectional specification
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| Organization: | DS |
| Publication Date: | 16 January 1998 |
| Status: | active |
| Page Count: | 6 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for the printed boards intended to be accepted under the IECQ.
Document History
DS/EN 62326-4
January 16, 1998
Printed boards - Part 4: Rigid multilayer boards with interlayer connections - Sectional specification
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made....
References
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