DLA - SMD-5962-90812 REV B
MICROCIRCUIT, LINEAR, HIGH SPEED BUFFER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 30 August 1994 |
| Status: | inactive |
| Page Count: | 11 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 LM6121 High speed buffer
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 can P GDIP1-T8 or CDIP2-T8 8 dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VS) (V+ to V−) . . . . . . . . . . . . . . . . . 36 V dc Input to output voltage 2/ . . . . . . . . . . . . . . . . . . ±7 V dc Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . ±VS Output to short-circuit to GND 3/ . . . . . . . . . . . . . . . Continuous Power dissipation, (PD) 4/ . . . . . . . . . . . . . . . . . . 750 mW Thermal resistance, junction-to-case (ΘJC): Case outline G . . . . . . . . . . . . . . . . . . . . . . . . 17°C/W Case outline P . . . . . . . . . . . . . . . . . . . . . . . . 19°C/W Thermal resistance, junction-to-ambient (ΘJA): Case outline G . . . . . . . . . . . . . . . . . . . . . . . . 150°C/W Case outline P . . . . . . . . . . . . . . . . . . . . . . . . 119°C/W Storage temperature range . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . +260°C Junction temperature (TJ) . . . . . . . . . . . . . . . . . . +150°C
Supply voltage (VS) . . . . . . . . . . . . . . . . . . . . . . ±15 V dc Ambient operating temperature range (TA) . . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits... View More
Document History
