scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL- PRF-38535, appendix A

The complete PIN is as shown in the following example:

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 10H531 Dual D-type master slave flip-flop

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat package X CDFP4-F16 16 Flat package 2 CQCC1-N20 20 Square chip carrier

The lead finish is as specified in MIL-PRF-38535, appendix A.

Supply voltage range(V_EE)...................... −8.0 V dc to 0.0 V dc Input voltage range............................ −5.2 V dc to 0.0 V dc Storage temperature range...................... −65° C to +165° C Lead temperature(soldering, 10 seconds)........ +300° C Junction temperature(T_J)....................... +165° C Maximum powder dissipation(P_D)................. 370 mW Thermal resistance, junction-to-case(ΘJ_C)...... See MIL-STD-1835

Supply voltage range(V_EE)...................... −5.46 V dc minimum to −4.94 V dc maximum Supply voltage range(V_CC)...................... −0.02 V dc to 0.02 V dc or 1.98 V dc to 2.02 V dc Ambient operating temperature range(T_A)........ −55° C to + 125° C Minimum high level input voltage(V_IH): T_A = +25 C.................................... − 0.780 V T_A = +125 C................................... − 0.650 V T_A =− 55 C.................................... − 0.840 V Maximum low level input voltage(V_IL)........... − 1.950 V

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.