IPC-TM-650 2.4.14.1

Solderability, Wave Solder Method

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Organization: IPC
Publication Date: 1 March 1979
Status: active
Page Count: 3
scope:

This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the PWB. This is determined by evaluating the ability of those portions of the PWB normally soldered to be wetted by a new coat of solder. Determination is judged visibly by non-destructive methods. The standard does not specifically relate to the solderability of the walls of plated-through holes (PTHs) but may be used for that purpose. This standard shall not be construed as a production procedure for preparing and soldering PWBs.

Document History

IPC-TM-650 2.4.14.1
March 1, 1979
Solderability, Wave Solder Method
This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered...

References

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