scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class 8 microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 5212A Transimpedance amplifier

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Power supply voltage (V_CC). . . . . . . . . . . . . . . . 6.0 V dc Ground differential . . . . . . . . . . . . . . . . . . . None allowed, short 4 ground pins together Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds). . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC). . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA) . . . . . . 158°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . +150°C Power dissipation (P_D). . . . . . . . . . . . . . . . . . 165 mW

Power supply voltage range (V_CC). . . . . . . . . . . . 4.5 V dc to 5.5 V dc Ambient operating temperature range (T_A). . . . . . . . −55°C to +125°C Transresistance power supply sensitivity (ΔR/ΔV): ΔV_CC = 5.0 V ±0.5 V. . . . . . . . . . . . . . . . . 9.6 typical Transresistance ambient temperature sensitivity (ΔR/ΔT) . . . . . . . . . . . . . . . . . 0.05 %/°C typical Input rms noise current spectral density (I_N): f = 10 MHz. . . . . . . . . . . . . . . . . . . . . . 2.5 pA√Hz typical Input rms noise current (I_T), f = 100 MHz . . . . . . 30 nA typical Power supply rejection ratio (PSRR): ECL configuration, f = 0.1 MHz . . . . . . . . . . . 23 dB typical Pulse distortion overload threshold (I_Pmax) . . . . . . ±300 µA typical

intended Use: