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IPC-4411

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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Organization: IPC
Publication Date: 1 November 2003
Status: active
Page Count: 32
scope:

This specification covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications.

Document History

IPC-4411
November 1, 2003
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
This specification covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and...
4411
April 1, 1999
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
A description is not available for this item.
IPC-4411
April 1, 1999
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
A description is not available for this item.

References

This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
TAPPI T 410 - Grammage of paper and paperboard (weight per unit area)
Published by TAPPI on January 1, 2013
In the United States the customary or commercial term for expressing the “weight” per unit area (more properly “mass per unit area”) of paper has been “basis weight,” “ream weight,” or “substance.”...
This document references:
TAPPI T 411 - Thickness (caliper) of paper, paperboard, and combined board
Published by TAPPI on January 1, 2015
This method describes the procedure for measuring single-sheet thickness and variations in single sheet thickness of paper, paperboard, and combined board. The term “combined board” encompasses both...
This document references:
T 1007 SP - Sample location for fiber glass mat sheets
Published by TAPPI on January 1, 2015
This practice covers the location from which samples are taken from a sheet of fiber glass mat used as a sample test unit for physical property determination.
This document is referenced by:
IPC-1731 - Strategic Raw Materials Supplier Qualification Profile
Published by IPC on June 1, 2000
This Strategic Raw Material Supplier Qualification Profile (SRMSQP) isn't intended to satisfy all of the customer's requirements, however conscientious maintenance of this document and/or...
This document is referenced by:
IPC-4103 - Specification for Base Materials for High Speed/High Frequency Applications
Published by IPC on November 1, 2017
This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital...
This document is referenced by:
IPC-4101 GERMAN - Specification for Base Materials for Rigid and Multilayer Printed Boards
Published by IPC on August 1, 2009
Diese Spezifikation beinhaltet die Anforderungen an Basismaterialien, hier als Laminate oder Prepregs bezeichnet, die hauptsächlich in starren Leiterplatten oder Multilayerleiterplatten für...
This document is referenced by:
IPC-4101 CHINESE - Specification for Base Materials for Rigid and Multilayer Printed Boards
Published by IPC on March 1, 2017
A description is not available for this item.
This document is referenced by:
IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards
Published by IPC on March 1, 2017
This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic...
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