scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 10H751 Quad TTL/NMOS to MECL translator

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line package S GDFP2-F20 or CDFP3-F20 20 flat package 2 CQCC1-N20 20 square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked an the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range at V_CC (GND = 0.0 V) ECL,TTL - - - - - - - 0.0 V dc minimum to 8.0 V dc maximum Input voltage range (V_IN) - - - - - - - - - - - - - - - - - - - 0 V dc to V_CC Output source current, (I_O): continous - - - - - - - - - - - - - - - - - - - - - - - - - - 50 mA surge - - - - - - - - - - - - - - - - - - - - - - - - - - - - 100 mA Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Junction temperature (T_J)- - - - - - - - - - - - - - - - - - - - +165°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - - 1960 mW Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - - See MIL-STD-1835

Supply voltage range at (GND = 0 V), ECL, TTL- - - - - - - - - - - 4.75 V dc minimum to 5.25 V dc maximum Ambient operating temperature range (T_A) - - - - - - - - - - - - - −55°C to +125°C Minimum high level input voltage (V_IH): T_A = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - - +2.0 V T_A = +125°C - - - - - - - - - - - - - - - - - - - - - - - - - - +2.0 V T_A = −55°C - - - - - - - - - - - - - - - - - - - - - - - - - - +2.0 V Maximum low level input voltage (V_IL): T_A = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - - +0.8 V T_A = +125°C - - - - - - - - - - - - - - - - - - - - - - - - - - +0.8 V T_A = −55°C - - - - - - - - - - - - - - - - - - - - - - - - - - +0.8 V

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - 2/ percent

intended Use: