scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 See 6.6 2048 × 9 FIFO 80 ns 02 See 6.6 2048 × 9 FIFO 65 ns 03 See 6.6 2048 × 9 FIFO 50 ns 04 See 6.6 2048 × 9 FIFO 40 ns 05 See 6.6 2048 × 9 FIFO 30 ns 06 See 6.6 2048 × 9 FIFO 20 ns 07 See 6.6 2048 × 9 FIFO 25 ns

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-fine package Y CDIP3-T28 or GDIP4-T28 28 Dual-in-fine package Z CQCC1-N32 32 Rectangular leadless chip carrier U GDFP2-F28 28 Flat package

Supply voltage range .................................... −0.5 V dc to +7.0 V dc DC voltage applied to outputs in high-Z state ........... −0.5 V dc to +7.0 V dc DC input voltage range .................................. −0.5 V dc to +7.0 V dc 1/ DC output current ....................................... 20 mA Maximum power dissipation 2/ ............................ 1.0 W Lead temperature (soldering, 10 seconds) ................ +260°C Thermal resistance, junction-to-case (Θ_JC): ............. See MIL-STD-1835 Junction temperature (T_J) 3/ ............................ +150°C Storage temperature range ............................... −65°C to +150°C Temperature under bias .................................. −55°C to +125°C

Supply voltage range (V_CC) .............................. +4.5 V dc to +5.5 V dc Ground voltage (GND) .................................... 0 V dc Input high voltage (V_IH) ................................ 2.2 V dc minimum 4/ Input low voltage (V_IL) ................................. 0.8 V dc maximum Case operating temperature range (T_C) ................... −55°C to + 125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.