scope:

This specification covers the detail requirements for monolithic silicon, TTL, data decoders/demultiplexers logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510, with the exception that the "JAN" or "J" certification shall not be used.

The device types shall be as shown in the following:

Device type Circuit 01 4-line to 16-line decoder/demultiplexer 02 Dual 2-line to 4-line decoder/demultiplexer 03 Dual 2-line to 4-line decoder/demultiplexer, open collector 04 Binary-to-octal decoder 05 BCD-to-decimal decoder 06 BCD-to-decimal decoder

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outlines shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) A F-1 (l4-lead, ¼" × ¼"), flat package B F-3 (14-lead, 3/16" × ¼"), flat package C D-1 (14-lead, ¼" × ¾"), dual-in-line package D F-2 (14-lead, ¼" × ⅜"), flat package E D-2 (16-lead, ¼" × ⅞"), dual-in-line package F F-5 (16-lead, ¼" × ⅜"), flat package J D-3 (24-lead, ½" × 1¼"), dual-in-line package K F-6 (24-lead, ⅜" × ⅝ flat package Z F-8 (24-lead, ¼" × ⅜"), flat package

Supply voltage range - - - - - - - - - - - −0.5 V dc to 7.0 V dc Input voltage range - - - - - - - - - - - - −1.5 V dc at −12 mA to 5.5 V dc Storage temperature range - - - - - - - - - −65°C to +150°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Maximum power dissipation per gate (P_D) 1/: Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - 270 mW Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - 195 mW Device type 03 - - - - - - - - - - - - - - - - - - - - - - - - 195 mW Device type 04 - - - - - - - - - - - - - - - - - - - - - - - 140 mW Device type 05 - - - - - - - - - - - - - - - - - - - - - - - - 190 mW Device type 06 - - - - - - - - - - - - - - - - - - - - - - - - 190 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC): Cases A, B, C, D, E, F, J, K and Z - - - - - - - - - - - - - - (See MIL-M-38510, appendix C) Junction temperature (T_J) 2/ - - - - - - - - - - - - - - - - - - +175°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (V_IH) - - - - - - - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - - - - - - - - 0.8 V dc Normalized fanout (each output) 3/ At low logic level - - - - - - - - - - - - - - - - - - - - - - 10 maximum At high logic level 4/ - - - - - - - - - - - - - 20 maximum Case operating temperature range (T_C) - - - - - - - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this specification are intended for logistic support of existing equipment.