scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT373 Octal transparent latch with three-state outputs, and TTL compatible inputs 02 54ACT11373 Octal transparent latch with three-state outputs, and TTL compatible inputs

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline L D-9 (24-lead, 1.280" × .310" × .200"), dual-in-line package R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage 1/ - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 Vdc DC output voltage 1/ - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 Vdc Clamp diode current - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - ±50 mA DC V_CC or GND current - - - - - - - - - - - - - - - ±100 mA Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) 2/ - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC) - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) 3/ - - - - - - - - - - - +175°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Input voltage - - - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage - - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C Input rise or fall times, V_CC = 4.5 V, V_CC = 5.5 V - - 0 to 8 ns/V Minimum setup time, Dn to LE (t_s): T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - - - 7.0 ns T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - - - 8.5 ns Minimum hold time, Dn to LE (t_h): Device type 01, T_C = +25°C, V_CC = 4.5 V - - - - - - - 0.0 nS Device type 01, T_C = −55°C to +125°C, V_CC = 4.5 V - - 1.0 ns Device type 02, T_C = +25°C, V_CC = 4.5 V - - - - - - - 3.5 ns Device type 02, T_C = −55°C to +125°C, V_CC = 4.5 V - - 3.5 ns Minimum pulse width, LE (t_w): T_C = +25°C, V_CC = 4.5 V - - - - - - - - - - - - - - - 7.0 ns T_C = −55°C to +125°C, V_CC = 4.5 V - - - - - - - - - - 8.5 ns

Unless otherwise specified, the following specification, standard, and bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.

SPECIFICATION MILITARY MIL-M-38510 - Microcircuits, General Specification for. STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD's).

(Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.)

In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence.

intended Use: