scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function t_PD 01 V5000 60-input 52-output 25 ns AND-OR-logic array 02 V5000 60-input 52-output 35 ns AND-OR-logic array 03 V5000L 60-input 52-output 35 ns AND-OR-logic array

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA3-P68 68 1/ Pin grid array 2/ Y GQCC1-J68 68 "J" lead chip carrier 2/

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . −2.0 V dc to +7.0 V dc 5/ Output voltage range applied . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc 5/ Output sink current . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA Thermal resistance, junction-to-case (θ_JC) . . . . . . . . . . . . . . See MIL-STD-1835 Maximum power dissipation (P_D) 6/ . . . . . . . . . . . . . . . . . 1.2 W Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . +175°C Lead temperature (soldering, 10 seconds maximum) . . . . . . . . . . . +300°C Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 years (minimum) Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 erase/write cycles (minimum)

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc maximum Supply voltage (V_SS) . . . . . . . . . . . . . . . . . . . . . . . . . 0.0 V dc High level input voltage (V_IH) . . . . . . . . . . . . . . . . . . . . 2.0 V dc minimum Low level input voltage (V_IL) . . . . . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (T_C). . . . . . . . . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . XX percent 7/

intended Use: