scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 LM139A Quad voltage comparator

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack X See figure 1 14 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Supply voltage range. . . . . . . . . . . . . . . . . . . . . . . . . 36 V dc or ±18 V dc Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc to 36 V dc Sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Storage temperature range (T_STG) . . . . . . . . . . . . . . . . . . −65°C to 150°C Maximum power dissipation (P_D) 2/ . . . . . . . . . . . . . . . . . . 900 mW Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . +300°C Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . +150°C Thermal resistance, junction-to-case (θ_JC) . . . . . . . . . . . . . 23°C/W Thermal resistance, junction-to-ambient (θ_JA): Case outline C . . . . . . . . . . . . . . . . . . . . . . . . . . 103°C/W still air 65°C/W 500 LFPM Case outlines D, X . . . . . . . . . . . . . . . . . . . . . . . . 183°C/W still air 120°C/W 500 LFPM

Supply voltage range . . . . . . . . . . . . . . . . . . . . . . . . . 5 V dc to 30 V dc Ambient operating temperature range (T_A) . . . . . . . . . . . . . . . −55°C to +125°C

intended Use: