UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DLA - SMD-5962-90606

MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 1 February 1993
Status: inactive
Page Count: 13
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54F113 Dual J-K negative edge-triggered flip-flop with set input 02 54F112 Dual J-K negative edge-triggered flip-flop with set and reset inputs

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line D GDFP1-F14 or CDFP2-F14 14 flat pack E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat pack 2 CQCC1-N20 20 square chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without performance.

Supply voltage range - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc minimum to +7.0 V dc maximum Input voltage range - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc minimum to +7.0 V dc maximum Input current range - - - - - - - - - - - - - - - - - - - - - - −30.0 mA to +5.0 mA Voltage applied to output in high output state range - - - - - - −0.5 V to VCC Current applied to output in low output state - - - - - - - - - 40 mA Storage temperature range - - - - - - - - - - - - - - - - - - - −65°C to +150°C Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +300°C Maximum power dissipation (PD) 1/ Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - 115.5 mW Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - 104.5 mW

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) - - - - - - - - - - - - - 2.0 V dc Maximum low level input voltage (VIL) - - - - - - - - - - - - - 0.8 V dc Maximum input clamp current (IIK) - - - - - - - - - - - - - - - −18 mA Maximum high level output current (IOH) - - - - - - - - - - - - −1.0 mA Maximum low level output current (IOL) - - - - - - - - - - - - - 20 mA Case operating temperature range (TC) - - - - - - - - - - - - - −55°C to +125°C Minimum setup time, Jn or Kn to [C bar][P bar]n, high (ts(H)) TC = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C Device type 01 - - - - - - - - - - - - - - - - - - - - - - - 6.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - - - - 5.0 ns Minimum setup time, Jn or Kn to [C bar][P bar]n, low (ts(L)) TC = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - 3.5 ns TC = −55°C, +125°C Device type 01 - - - - - - - - - - - - - - - - - - - - - - - 5.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - - - - 4.0 ns Minimum setup time, Jn or Kn to [C bar][P bar]n, high or low (th(H), th(L)) - - - - - - - - - - - - - - - - - - 0.0 ns Minimum [C bar][P bar]n pulse width, high or low (tw(H), tw(L)) TC = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 ns TC = −55°C, +125°C - - - - - - - - - - - - - - - - - - - - - 5.0 ns Minimum [S bar][D bar]n or [R bar][D bar]n pulse width, low (tw(L)) TC = +25°C - - - - - - - - - - - - - - - - - - - - - - - - - 4.5 ns TC = −55°C, +125°C - - - - - - - - - - - - - - - - - - - - - 5.0 ns Minimum recovery time, [S bar][D bar]n or [R bar][D bar]n to [C bar][P bar]n, (trec) TC = +25°C Device type 01 - - - - - - - - - - - - - - - - - - - - - - - 4.5 ns Device type 02 - - - - - - - - - - - - - - - - - - - - - - - 4.0 ns TC = −55°C, +125°C Device type 01 - - - - - - - - - - - - - - - - - - - - - - - 6.0 ns Device type 02 - - - - - - - - - - - - - - - - - - - - - - - 5.0 ns

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD 5962-90606
January 9, 2020
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
SMD 5962-90606
January 12, 2015
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD 5962-90606
March 6, 2008
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. .
SMD-5962-90606 REV A
May 24, 2000
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-90606
February 1, 1993
MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, FLIP-FLOP, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....

References

This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
View Less
View All
Advertisement