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DLA - SMD-5962-87609 REV B

MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 14 August 1989
Status: inactive
Page Count: 12
scope:

This drawing, describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC04 Hex inverter 02 54AC11004 Hex inverter

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline C D-1 (14-lead, .785" × .310" × .200") dual-in-line package D F-2 (14-lead, 390" × .260" × .085") flat-package R D-8 (20-lead, 1.060" × .310" × .200") dual-in-line package S F-9 (20-lead .540" × .300" × .100") flat package 2 C-2 (20-terminal, .358" × .358" × .100") square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage 1/ - - - - - - - - - - - - - - - - - −0.5 V dc to VCC+ 0.5 V dc DC output voltage 1/ - - - - - - - - - - - - - - - - −0.5 V dc to VCC+ 0.5 V dc Clamp diode current - - - - - - - - - - - - - - - - - ±20 mA DC output current (per pin) - - - - - - - - - - - - - ±50 mA DC VCC or GND current - - - - - - - - - - - - - - - - ±100 mA Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θJC) - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) 2/- - - - - - - - - - - - - - +175°C

Supply voltage (VCC) 3/ - - - - - - - - - - - - - - - - 3.0 V dc minimum to 5.5 V dc maximum Input voltage - - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Output voltage - - - - - - - - - - - - - - - - - - - 0.0 V dc to VCC Case operating temperature range (TC) - - - - - - - - −55°C to +125°C Input rise or fall times, VCC = 3.6 V, VCC = 5.5 V - 0 to 8 ns/V

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

SMD 5962-87609
November 27, 2019
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead...
SMD 5962-87609
March 22, 2018
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-87609
March 20, 2014
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD 5962-87609
February 16, 2007
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
SMD-5962-87609 REV D
August 20, 2004
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-87609 REV C
February 12, 2001
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by...
SMD-5962-87609 REV B
August 14, 1989
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
This drawing, describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
SMD-5962-87609 REV A
November 25, 1987
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-87609
June 24, 1987
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, HEX INVERTER, MONOLITHIC SILICON
A description is not available for this item.
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References

This document references:
JEDEC JESD 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices
Published by JEDEC on January 1, 1990
This standard describes electrical parameters for this class of CMOS devices.
This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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