scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part of Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit functions follow:

Device type Generic number Circuit function Minimum Operating Period 01 RX1750 Microprocessor, multichip module 50 ns 02 RX1750 Microprocessor, multichip module 50 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification MIL-PRF-38535

The case outline(s) are as designated in MIL-PRF-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Y See figure 1 200 Quad flat package 1/

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_DD) ............................................ −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) .......................................... −0.5 V dc to V_DD +0.5 V dc DC output voltage range (V_OUT) ........................................ −0.5 V dc to V_DD +0.5 V dc DC input current (I_IN)3/ .............................................. ±50 mA DC output current (I_OUT)4/ ............................................ ±50 mA Power dissipation,(f=20 Mhz) (P_D) ..................................... 2.5 W (peak) Lead temperature (soldering, 5 seconds) ............................... +270°C Maximum junction temperature (T_J) ..................................... +175°c Thermal resistance, junction-to-case (θ_JC) ............................ ≤ 1.0°C/W ESD ................................................................... Class 1 (1000 V) Storage temperature range ..............................................−65°C to +150°C

Supply voltage range (V_DD) ............................................ 4.5 V dc to 5.5 V dc DC input voltage range (V_IN) .......................................... −0.3 V dc to V_DD +0.3 V dc DC output voltage range (V_OUT) .........................................−0.3 V dc to V_DD + 0.3 V dc DC input current (I_IN)3/ .............................................. ±10 mA DC output current (I_OUT)4/ ............................................ ±12 mA Capacitive output load (C_L)5/ ......................................... 50 pF Case operating temperature range (T_C) ................................. −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ......................... 98 percent 2/

intended Use: