scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 54LVC14A Hex schmitt-trigger inverter
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-Fl4 or CDFP2-Fl4 14 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage range (VCC) .................................................................... −0.5 V dc to +6.5 V dc
DC input voltage range (VIN) .................................................................. −0.5 V dc to +6.5 V dc 4/
DC output voltage range (VOUT) ................................................................ −0.5 V dc to VCC +0.5 V dc 4/ 5/
DC input clamp current (IIK) (VIN < 0.0 V) .................................................... −50 mA
DC output clamp current (IOK) (Vout < 0.0 V or V OUT > VCC).................................... ±50 mA
Continuous output current (IOUT) (VOUT = 0.0 to VCC)........................................... ±50 mA
Continuous current through VCC or GND ......................................................... ±100 mA
Maximum power dissipation at TA = +55°C (in still air) ........................................ 0.5 W 6/
Storage temperature range (TSTG) .............................................................. −65°C to +150°C
Lead temperature (soldering, 10 seconds) ...................................................... +300°C
Thermal resistance, junction-to-case (ΘJC)..................................................... See MIL-STD-1835
Junction temperature (TJ) ..................................................................... + 175°C
Supply voltage range (VCC) (Operating)......................................................... +2.0 V dc to +3.6 V dc
(Data retention only) .............................................. +1.5 V dc
Minimum high level input voltage (VIH) (VCC = 2.7 V to 3.6. V) ................................ 2.0 V
Maximum low level input voltage (VIL) (VCC = 2.7 V to 3.6 V) .................................. +0.8 V
Input voltage range (VIN) ..................................................................... 0.0 V to +5.5 V dc
Output voltage range (VOUT) ................................................................... 0.0 V to VCC
Maximum high level output current (IOH) (VCC = 2.7 V) ......................................... −12 mA
(VCC = 3.0 V) ......................................... −24 mA
Maximum low level output current (IOL) (VCC = 2.7 V) .......................................... +12mA
(VCC = 3.0 V) .......................................... +24 mA
Input transition rise or fall time (Δt/ΔV) .................................................... 0 to 10 ns/V
Case operating temperature range (TC) ......................................................... −55°C to + 125°C
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ................................................. XX percent 8/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications(original equipment), design applications, and logistics purposes.
Microcircuits... View More
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications(original equipment), design applications, and logistics purposes.
Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
Device class Q devices will replace device class M devices.
View Less