scope:

This specification covers the detail requirements for monolithic silicon, Schottky TTL, data selectors/multiplexers (three-state) microcircuits. Two product assurance classes and a choice of case outlines and lead-finishes are provided and are reflected in the complete part number.

The complete part number shall be in accordance with MIL-M-38510, and as specified herein.

The device type shall be as follows:

Device type Circuit 01 8-input, data selector/multiplexer 02 Dual, 4-input, data selector/multiplexer 03 Quad, 2-input, data selector/multiplexer 04 Quad, 2-input, data selector/multiplexer with inverted output 05 8-input, data selector/multiplexer with 3-state outputs 06 Quad, 2-input, data selector/multiplexer with 3-state outputs 07 Quad, 2-input, data selector/multiplexer with 3-state inverted output 08 Dual, 4-input, data selector/multiplexer with 3-state outputs.

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outline shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) E D-2 (16-lead, ¼" × ⅞") dual-in-line package F F-5 (16-lead, ¼" × ⅜") flat package 2 C-2 (20-terminal, .350" × .350"), square chip carrier package X C-2A (20-terminal, .350" × .350"), square chip carrier package

Supply voltage range- - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - −1.2 V dc at −18 mA to +5.5 V dc Storage temperature range - - - - - - - - - −65°C to +150°C

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center (RBE-2), Griffiss AFB, NY 13441, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Maximum power dissipation (P_D) 1/: Device types 01 and 02- - - - - - - - - 385 mW Device type 03- - - - - - - - - - - - - 430 mW Device type 04- - - - - - - - - - - - - 336 mW Device type 05- - - - - - - - - - - - - 468 mW Device type 06- - - - - - - - - - - - - 545 mW Device type 07- - - - - - - - - - - - - 479 mW Device type 08- - - - - - - - - - - - - 550 mW Lead temperature (soldering, 10 seconds)- 300°C Thermal resistance, junction-to-case (θ_JC): Cases E, F, 2, and X- - - - - - - - - - (See MIL-M-38510, appendix C) Junction temperature (T_J) 2/ - - - - - - +175°C

Supply voltage (V_CC)- - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high-level input voltage (V_IH)- - 2.0 V dc Maximum low-level input voltage (V_IL) 3/- 0.8 V dc Case operating temperature range (T_C) - - −55°C to +125°C

intended Use:

Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.