scope:

This specification covers the requirements for a solventborne conductive low bake primer for use over plastics, including those with in-mold coatings. The surfacer shall be smooth, adhesion promoting, conductive surface for electrostatic application of subsequent coatings. The surfacer must be sandable, and have the ability to fill minor surface imperfections in the substrate. It must also provide Ultraviolet (UV) light protection to any underlying coatings and the substrates.

Material Description. This primer is part of the total painted product system and must provide a smooth, adhesion promoting coating direct to substrate or in-mold coating and to subsequent coatings. This specification shall be used in conjunction with the Approved Paint on Plastics Systems (APOPS), a section of the Materials Specifications file (MATSPC), which lists approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797. Primers approved to this specification must cure and meet all performance requirements at bake temperatures less than or equal to 82 °C (180 °F).

Symbols. Not applicable.

Applicability. Primers covered under this specification are typically applied to rigid plastic substrates that could lose functional or dimensional integrity at higher bake temperatures. They are used under an approved topcoat system.