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JSA - JIS C 5201-2

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors

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Organization: JSA
Publication Date: 20 November 2014
Status: active
ICS Code (Fixed resistors): 31.040.10

Document History

JIS C 5201-2
November 20, 2014
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
A description is not available for this item.
JIS C 5201-2
July 20, 1998
Fixed resistors for use in electronic equipment Part 2: Sectional specification: Fixed low-power non-wirewound resistors
A description is not available for this item.

References

This document references:
IEC 60294 - Measurement of the dimensions of a cylindrical component with axial terminations
Published by IEC on July 1, 2012
This International Standard applies to cylindrical capacitors and resistors for use in electronic equipment. This standard gives methods for measurement of the body length and for checking the...
This document references:
IEC 60301 - Preferred diameters of wire terminations of capacitors and resistors
Published by IEC on July 1, 2012
This International Standard gives a series of preferred diameters of the finished wire terminations of capacitors and resistors for use in electronic equipment.
This document references:
IEC 61760-1 - Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by IEC on July 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
This document references:
JIS C 0806-1 - Packaging of components for automatic handling -- Part 1: Tape packaging of components with axial leads on continuous tapes
Published by JSA on March 23, 2020
A description is not available for this item.
This document references:
JIS C 5005-2 - Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Published by JSA on May 20, 2010
A description is not available for this item.
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