scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class 6 microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 82C37ARH Radiation hardened CMOS high performance programmable DMA controller

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Q CDIP2-T40 40 dual-in-line package X See figure 1 42 flatpack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_DD) - - - - - - - - - - - - - - - - - - - - - - - - +6.5 V dc Input or output voltage - - - - - - - - - - - - - - - - - - - - - - V_SS −0.3 V dc to V_DD +0.3 V dc Storage temperature range (T_STG) - - - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering 10 seconds) (T_S) - - - - - - - - - - - - +300°C Thermal resistance junction-to-case (Θ_JC): Case outline Q - - - - - - - - - - - - - - - - - - - - - - - - - 5°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - 10°C/W Thermal resistance junction-to-ambient (Θ_JA): Case outline Q - - - - - - - - - - - - - - - - - - - - - - - - - 38°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - 72°C/W Maximum package power dissipation at T_A = +125°C (P_D):2/ Case outline Q - - - - - - - - - - - - - - - - - - - - - - - - 1.32 W Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - 0.69 W

Operating supply voltage range (V_DD) - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Operating temperature range (T_A) - - - - - - - - - - - - - - - - - - −55°C to +125°C Input low voltage range (V_IL) - - - - - - - - - - - - - - - - - - - 0 V dc to +0.8 V dc Input high voltage range (V_IH) - - - - - - - - - - - - - - - - - - - V_DD −1.5 V dc to V_DD Radiation features Total dose - - - - - - - - - - - - - - - - - - - - - - - - - - - - > 100 k Rads(SI) Transient upset - - - - - - - - - - - - - - - - - - - - - - - - - > 10⁸ RAD(SI)/sec 3/ Single event phenomenon effective linear energy threshold, no upsets - - - - - - - - - - - - - - 9 MEV/(mg/cm²) 3/

intended Use: