DSF/FPREN 61189-3-913
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
pending
| Organization: | DS |
| Status: | pending |
| Page Count: | 12 |
scope:
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).
Document History
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for...
DSF/FPREN 61189-3-913
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for...