DSF/FPREN 61189-3-913
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
pending, Most Current
| Organization: | DS |
| Status: | pending |
| Page Count: | 31 |
scope:
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs).
Document History
DSF/FPREN 61189-3-913
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for...
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of printed circuit board for high-brightness LEDs
This standard specifies the test methods for thermal conductivity specific to the printed circuit board for high-brightness LEDs. The test shall be applicable to the printed circuit board for...