DIN EN 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 May 2015 |
| Status: | inactive |
| Page Count: | 72 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
DIN EN 61190-1-3
May 1, 2015
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)
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