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IEC 60194

Printed board design, manufacture and assembly - Terms and definitions

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Organization: IEC
Publication Date: 1 April 2015
Status: inactive
Page Count: 528
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

Document History

IEC 60194
April 1, 2015
Printed board design, manufacture and assembly - Terms and definitions
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
IEC 60194
February 1, 2006
Printed board design, manufacture and assembly – Terms and definitions
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.  
IEC 60194
April 1, 1999
Printed Board Design, Manufacture and Assembly - Terms and Definitions
A description is not available for this item.
IEC 60194
January 1, 1988
Terms and Definitions for Printed Circuits
A description is not available for this item.

References

This document references:
60050 - Vocabulary of Fundamental Concepts
Published by IEC on January 1, 1985
The I E C, the International Electrotechnical Commission, is entrusted with preparing the terminology covering all the concepts relating to electricity. This vocabulary (IEV) is grouped in some 80...
This document references:
IEC 60050-113 - AMENDMENT 2 International Electrotechnical Vocabulary (IEV) – Part 113: Physics for electrotechnology
Published by IEC on October 1, 2019
A description is not available for this item.
This document references:
IEC 60050-121 - AMENDMENT 4 International Electrotechnical Vocabulary (IEV) – Part 121: Electromagnetism
Published by IEC on January 1, 2021
A description is not available for this item.
This document references:
IEC 60050-131 - AMENDMENT 1 International Electrotechnical Vocabulary – Part 131: Circuit theory
Published by IEC on September 1, 2008
This part of IEC 60050 gives the general terminology used in the theory of electric and magnetic circuits, as well as general terms pertaining to circuit elements and their characteristics, to...
This document references:
IEC 60050-151 - International Electrotechnical Vocabulary Part 151: Electrical and Magnetic Devices
Published by IEC on July 1, 2001
This part of IEC 60050 gives the general terminology used in the various fields of electrotechnology (e.g. "electricity", "magnetism", "electronics", "device", "component", etc.), general terms...
This document is referenced by:
BS PD IEC/TS 62878-2-3 - Device embedded substrate Part 2-3: Guidelines — Design guide
Published by BSI on April 30, 2015
A description is not available for this item.
This document is referenced by:
BS PD IEC/TS 62878-2-1 - Device embedded substrate Part 2-1: Guidelines — General description of technology
Published by BSI on April 30, 2015
A description is not available for this item.
This document is referenced by:
BS PD IEC/TS 62878-2-4 - Device embedded substrate Part 2-4: Guidelines — Test element groups (TEG)
Published by BSI on April 30, 2015
A description is not available for this item.
This document is referenced by:
JIS C 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Published by JSA on April 20, 2015
A description is not available for this item.
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