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IEC 60194

Printed board design, manufacture and assembly – Terms and definitions

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Organization: IEC
Publication Date: 1 February 2006
Status: inactive
Page Count: 124
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

 

Document History

IEC 60194
April 1, 2015
Printed board design, manufacture and assembly - Terms and definitions
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
IEC 60194
February 1, 2006
Printed board design, manufacture and assembly – Terms and definitions
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.  
IEC 60194
April 1, 1999
Printed Board Design, Manufacture and Assembly - Terms and Definitions
A description is not available for this item.
IEC 60194
January 1, 1988
Terms and Definitions for Printed Circuits
A description is not available for this item.

References

This document references:
IEC 60050-541 - AMENDMENT 1 International Electrotechnical Vocabulary – Part 541: Printed circuits
Published by IEC on February 1, 2015
A description is not available for this item.
This document is referenced by:
EN 60664-3 - Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
Published by CENELEC on June 1, 2017
This part of IEC 60664 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC...
This document is referenced by:
IEC 61249-2-21 - Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced Base Materials, Clad and Unclad - Non-halogenated Epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Published by IEC on November 1, 2003
This part of IEC 61249 gives requirements for properties of non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in...
This document is referenced by:
IEC 60068-2-77 - Environmental Testing - Part 2-77: Tests - Test 77: Body Strength and Impact Shock
Published by IEC on January 1, 1999
Scope and object This part of IEC 60068 provides test methods applicable to surface mounting devices (SMDs) made of glass or sintered materials such as capacitors, resistors and inductors...
This document is referenced by:
IPC-WP/TR-584 - IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies
Published by IPC on August 1, 2007
This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision...
This document is referenced by:
EN IEC 61760-3 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by CENELEC on March 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
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