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BSI - BS EN 61189-5-2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies — Soldering flux for printed board assemblies

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Organization: BSI
Publication Date: 31 January 2015
Status: active
Page Count: 46
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61189-5-2
January 31, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies — Soldering flux for printed board assemblies
A description is not available for this item.
BS IEC 61189-5-2
January 31, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies — Soldering flux for printed board assemblies
A description is not available for this item.

References

This document references:
ISO 9455-1 - Soft Soldering Fluxes - Test Methods - Part 1: Determination of Non- Volatile Matter, Gravimetric Method (CEN EN 29455-1: 1993)
Published by ISO on January 1, 1990
A description is not available for this item.
This document references:
ISO 9455-2 - Soft Soldering Fluxes - Test Methods - Part 2: Determination of Non-Volatile Matter, Ebulliometric Method
Published by ISO on January 1, 1993
A description is not available for this item.
This document references:
BS ISO 5725-2 - Accuracy (trueness and precision) of measurement methods and results Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
Published by BSI on December 31, 2019
A description is not available for this item.
This document references:
EN IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by CENELEC on May 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068‑2‑58. This...
This document references:
EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published by CENELEC on March 1, 2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
ISO 9455-1 - Soft Soldering Fluxes - Test Methods - Part 1: Determination of Non- Volatile Matter, Gravimetric Method (CEN EN 29455-1: 1993)
Published by ISO on January 1, 1990
A description is not available for this item.
This document is referenced by:
DIN EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Published by DIN on September 1, 2018
Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste...
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