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DIN EN IEC 61190-1-3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

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Organization: DIN
Publication Date: 1 September 2018
Status: active
Page Count: 44
ICS Code (Electronic component assemblies): 31.190
scope:

Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste zum Löten von Elektronikprodukten sowie für „spezielle" Elektroniklote fest. Zu den Fachgrundspezifikationen für Lotlegierungen und Flussmittel siehe ISO 9453. Dies ist ein Dokument zur Qualitätsprüfung und bezieht sich nicht direkt auf die Materialeigenschaften im Herstellungsprozess.

Spezielle Elektroniklote umfassen all die Lote, bei denen die hier aufgeführten Anforderungen an Standardlotlegierungen und Lotmaterialien nicht vollständig zutreffen. Einige Beispiele für spezielle Lote sind Anoden, Blöcke, Formteile, Stäbe mit Haken und Öse am Ende und Vielkomponenten-Lotpulver.

Document History

DIN EN IEC 61190-1-3
September 1, 2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Dieser Teil von IEC 61190 legt die Anforderungen und Prüfverfahren für Elektroniklote, für flussmittelgefüllte und massive Lote in Form von Barren, Stangen, Stäben und Bändern, Lotpulver und Lotpaste...

References

This document references:
BS EN 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies — Soldering flux for printed board assemblies
Published by BSI on January 31, 2015
A description is not available for this item.
This document references:
EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
EN 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
EN 61190-1-1 - Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by CENELEC on June 1, 2002
A description is not available for this item.
This document references:
EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by CENELEC on May 1, 2014
A description is not available for this item.
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