UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

VDI 3356

Guide pillars with lead-in chamfer in large stamping dies - Supplement to DIN 9833

inactive
Organization: VDI
Publication Date: 1 September 2005
Status: inactive
Page Count: 6
ICS Code (Modular units and other devices): 25.060.10
scope:

Field of application and advantages

The guide pillars with which this guideline is concerned are used in large-area dies and high-speed production presses.

In practice, with the guide pillars used as yet, the heat development within the die set has resulted in jamming and with that to the pillars being pulled out of the die, despite the "r6" pressure fit.

The hollow-bored version is to be preferred since the chimney effect and the lower mass of the pillar result in a sufficiently fast dissipation of the heat. It also has the positive effect of a remarkable reduction in weight.

The longer lead-in chamfer is particularly advantageous to handling with the crane during installation or removal (for example, in maintenance work). The following advantages are obtained with the new designs:

  • In case of sagging of the upper part of the die (under its own weight, for example, when being moved by crane), as the two halves of the die are brought together the risk of tilting and thus of jamming is reduced. This procedure is made easier not only by the longer lead-in chamfer but also by the enlargement of the fit (pillar to sleeve) of H7/g6 to H7/f6 (time saving).
  • A slight horizontal misalignment of the top half of the die with respect to the bottom half can be compensated by an early insertion of the guide pillars into the guide bushes.
  • Edge impacts on the entrance radius of the guide bush - due to, for example, deficiencies in the quality of guidance of the press ram - can be avoided very dependably thanks to the longer lead-in chamfer.
  • Heels guiding in some cases can be avoided by the use of larger pillar diameters depending on the application case (cost saving).

Document History

March 1, 2017
Guide pillars with lead-in chamfer in large stamping dies - Supplement to DIN 9833 und ISO 9182-3
The content of this standard has been tailored to the automotive industry’s special requirements for large stamping and forming dies and is intended to serve as a supplement to DIN 9833 and ISO...
VDI 3356
September 1, 2005
Guide pillars with lead-in chamfer in large stamping dies - Supplement to DIN 9833
Field of application and advantages The guide pillars with which this guideline is concerned are used in large-area dies and high-speed production presses. In practice, with the guide pillars used...

References

Advertisement