Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
|Publication Date:||1 April 2015|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.