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IEC 61189-2-721

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

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Organization: IEC
Publication Date: 1 April 2015
Status: active
Page Count: 48
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).

This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.

Document History

IEC 61189-2-721
April 1, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates...
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