IEC 61189-2-721
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
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| Organization: | IEC |
| Publication Date: | 1 April 2015 |
| Status: | active |
| Page Count: | 48 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.
Document History
IEC 61189-2-721
April 1, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates...