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BSI - 23/30481622 DC

Draft BS EN IEC 61249-2-53 ED1 Materials for printed boards and other interconnecting structures Part 2-53: Reinforced base materials clad and unclad - Ptfe unfilled laminate sheets of defined flammability (vertical burning test), copper-clad

pending, Most Current
Organization: BSI
Publication Date: 10 November 2023
Status: pending
Page Count: 23
ICS Code (Printed circuits and boards): 31.180

Document History

23/30481622 DC
November 10, 2023
Draft BS EN IEC 61249-2-53 ED1 Materials for printed boards and other interconnecting structures Part 2-53: Reinforced base materials clad and unclad - Ptfe unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
A description is not available for this item.

References

This document references:
IEC 60194-1 - Printed boards design, manufacture and assembly – Vocabulary – Part 1: Common usage in printed board and electronic assembly technologies
Published by IEC on February 1, 2021
This part of IEC 60194 covers terms and definitions closely related with TC 91 technology.
This document references:
IEC 60194-2 - Printed boards design, manufacture and assembly – Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Published by IEC on December 1, 2017
This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies
This document references:
IEC 61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-721: Test methods for materials for interconnection structures – Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Published by IEC on April 1, 2015
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tanδ ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates...
This document references:
61189-2-803 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Published by IEC on July 1, 2023
This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).
This document references:
61189-2-807 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
Published by IEC on September 1, 2021
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
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