IEC - 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 September 2021 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
Document History
61189-2-807
September 1, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (Td) using TGA
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).