scope:

Purpose. This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow). The heat can be either conducted heat through the termination into the component part, or radiant heat from the solder bath when in close proximity to the body of the component part, or both. The solder dip method is used as a reasonably close simulation of the conditions encountered in wave soldering, in regard to radiated and conducted heat. This test also is intended to evaluate the impact of reflow techniques to which components may be exposed. The heat of soldering can cause solder reflow which may affect the electrical characteristics of the component part and may cause mechanical damage to the materials making up the part, such as loosening of terminations or windings, softening of insulation, opening of solder seals, and weakening of mechanical joints.