scope:

This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this standard. To perform the tests, the devices must be assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This test method combines the main features of JEDEC JESD22-C101 and ANSI/ESD S5.3.1. New verification procedures and test condition definitions have been introduced to facilitate this combination.

Purpose

The purpose (objective) of this standard is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.