scope:

This Standard specifies the methods for measuring of melting temperature ranges of lead-free solders (hereafter referred to as "solder alloys") that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as connecting components.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 61189-11 : 2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11 : Measurement of melting temperature or melting temperature ranges of solder alloys (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.