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JEDEC JESD 22-B110

Subassembly Mechanical Shock

inactive
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Organization: JEDEC
Publication Date: 1 March 2001
Status: inactive
Page Count: 12

Document History

June 1, 2019
Mechanical Shock – Device and Subassembly
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to...
July 1, 2013
Mechanical Shock – Component and Subassembly
Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is...
November 1, 2004
Subassembly Mechanical Shock
The new test method JESD22-B110 provides guidance for in-situ testing of mechanical shock resistance of components as mounted in a subassembly. Using terms, procedures, and test levels in common with...
November 1, 2004
Subassembly Mechanical Shock
The Subassembly Mechanical Shock Test Method is intended to describe a method to evaluate subassemblies for use in electrical equipment. It is intended to determine the compatibility of the...
JEDEC JESD 22-B110
March 1, 2001
Subassembly Mechanical Shock
A description is not available for this item.
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