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JEDEC JESD 22-B110

Subassembly Mechanical Shock

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Organization: JEDEC
Publication Date: 1 November 2004
Status: inactive
Page Count: 16
scope:

The Subassembly Mechanical Shock Test Method is intended to describe a method to evaluate subassemblies for use in electrical equipment. It is intended to determine the compatibility of the subassemblies to withstand moderately severe shocks as a result of suddenly applied forces or abrupt change in motion produced by handling, transportation or field operation. Mechanical shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for the subassembly and is a means to test the components in a mounted state.

Document History

June 1, 2019
Mechanical Shock – Device and Subassembly
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to...
July 1, 2013
Mechanical Shock – Component and Subassembly
Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is...
November 1, 2004
Subassembly Mechanical Shock
The new test method JESD22-B110 provides guidance for in-situ testing of mechanical shock resistance of components as mounted in a subassembly. Using terms, procedures, and test levels in common with...
JEDEC JESD 22-B110
November 1, 2004
Subassembly Mechanical Shock
The Subassembly Mechanical Shock Test Method is intended to describe a method to evaluate subassemblies for use in electrical equipment. It is intended to determine the compatibility of the...
March 1, 2001
Subassembly Mechanical Shock
A description is not available for this item.

References

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