FORD WSF-M2G385-A1
ADHESIVE, TWO COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH
inactive
Buy Now
| Organization: | FORD |
| Publication Date: | 31 October 1994 |
| Status: | inactive |
| Page Count: | 4 |
scope:
1. SCOPE
The material defined by this specification is a two component, primerless, thermal cuing, solvent free, thermally conductive adhesive. This material shall consist of vinyl terminated polydimethyl siloxane, platinum catalyst, adhesion promoters and alumina powder.
Document History
February 3, 2015
ADHESIVE, TWO COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH ***TO BE USED WITH FORD WSS-M99P1111-A***
The material defined by this specification is a two component, primerless, thermal curing, solvent free, thermally conductive adhesive. This material shall consist of vinyl terminated polydimethyl...
January 16, 2003
ADHESIVE, TWO COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH ***TO BE USED WITH FORD WSS-M99P1111-A***
1. SCOPE
The material defined by this specification is a two component, primerless, thermal curing, solvent free, thermally conductive adhesive. This material shall consist of vinyl terminated...
FORD WSF-M2G385-A1
October 31, 1994
ADHESIVE, TWO COMPONENT SILICONE, THERMALLY CONDUCTIVE, HIGH DIELECTRIC STRENGTH
1. SCOPE The material defined by this specification is a two component, primerless, thermal cuing, solvent free, thermally conductive adhesive. This material shall consist of vinyl terminated...