scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HS245RH Radiation hardened DI triple line transmitter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C CDIP2-T14 14 Dual-in-line X CDFP3-F14 14 Flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +10 V dc Output voltage - - - - - - - - - - - - - - - - - - - - - - - - - −30 V with respect to V_CC Input voltage - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +10 V dc Storage temperature range - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum package power dissipation at T_A = +125°C (P_D): Case outline C - - - - - - - - - - - - - - - - - - - - - - - - 0.68 W 2/ Case outline X - - - - - - - - - - - - - - - - - - - - - - - - 0.43 W 2/ Thermal resistance, junction-to-case (Θ_JC): Case outline C - - - - - - - - - - - - - - - - - - - - - - - - 24°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - - 30°C/W Thermal resistance, junction-to-ambient (Θ_JA): Case outline C - - - - - - - - - - - - - - - - - - - - - - - - 74°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - - 116°C/W Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - +275°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - +175°C

Operating voltage range - - - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Ambient operating temperature range (T_A)- - - - - - - - - - - - - −55°C to +125°C Radiation features: Dose rate upset - - - - - - - - - - - - - - - - - - - - - - - - 1×10⁹ Rads (SI)/s Total dose - - - - - - - - - - - - - - - - - - - - - - - - - - 2×10⁵ Rads (Si) Dose rate latch-up 3/ - - - - - - - - - - - - - - - - - - - - - None Neutron - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5×10¹² N/cm²

intended Use: