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JSA - JIS C 61191-1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Organization: JSA
Publication Date: 20 November 2015
Status: inactive
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

JIS C 61191-1
February 22, 2021
Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
A description is not available for this item.
JIS C 61191-1
November 20, 2015
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
A description is not available for this item.
JIS C 61191-1
March 25, 2006
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
A description is not available for this item.

References

This document references:
JIS C 61191-2 - Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
Published by JSA on March 23, 2020
A description is not available for this item.
This document references:
IEC 61189-1 - Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Published by IEC on November 1, 2001
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 61193-3 - Quality assessment systems – Part 3: Selection and use of sampling plans for printed board and laminate endproduct and in-process auditing
Published by IEC on January 1, 2013
This part of IEC 61193 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and...
This document references:
IEC 61249-8-8 - Materials for Interconnection Structures - Part 8: Sectional Specification Set for Non-Conductive Films and Coatings - Section 8: Temporary Polymer Coatings
Published by IEC on June 1, 1997
A description is not available for this item.
This document references:
JIS C 61191-2 - Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
Published by JSA on March 23, 2020
A description is not available for this item.
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