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JSA - JIS C 61191-2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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Organization: JSA
Publication Date: 20 November 2015
Status: inactive
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

JIS C 61191-2
March 23, 2020
Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
A description is not available for this item.
JIS C 61191-2
November 20, 2015
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
A description is not available for this item.
JIS C 61191-2
March 25, 2006
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
A description is not available for this item.

References

This document references:
JIS C 61191-1 - Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by JSA on February 22, 2021
A description is not available for this item.
This document references:
JIS C 61191-1 - Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by JSA on February 22, 2021
A description is not available for this item.
This document is referenced by:
JIS C 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by JSA on December 20, 2016
A description is not available for this item.
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