IEC 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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| Organization: | IEC |
| Publication Date: | 1 January 2016 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Document History
IEC 61189-3-719
January 1, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3-719: Test methods for interconnection structures (printed boards) – Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical...