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IPC-4552

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

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Organization: IPC
Publication Date: 1 September 2012
Status: inactive
Page Count: 3

Document History

April 1, 2021
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is...
August 1, 2017
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a...
December 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...
IPC-4552
September 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
June 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
October 1, 2002
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...
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