IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
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| Organization: | IPC |
| Publication Date: | 1 September 2012 |
| Status: | inactive |
| Page Count: | 3 |
Document History
April 1, 2021
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is...
August 1, 2017
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a...
December 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...
IPC-4552
September 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
June 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
October 1, 2002
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...