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IPC - 4552B

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

active, Most Current
Organization: IPC
Publication Date: 1 April 2021
Status: active
Page Count: 156
scope:

This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). This standard may be used to specify acceptance criteria to meet performance requirements in addition to those found in the IPC-6010 series (IPC-6012, IPC-6013 and IPC-6018) of standards. The ENIG deposit specified by using this document will meet the highest coating durability rating as specified in the J-STD-003 printed board solderability specification.

This specification is based on three critical factors:

1) The ENIG plating process is in control producing a normal distribution for nickel and gold deposit thickness.

2) That the tool used to measure the deposit and therefore control the process is accurate and reproducible for the thickness range specified.

3) That the ENIG plating process results in uniform deposit characteristics.

If any of these three critical factors are not met, then the deposit produced will not meet the performance criteria defined herein.

Purpose

This specification sets the requirements specific to ENIG as a surface finish (see Table 3-1 for a summary of these requirements).

Document History

4552B
April 1, 2021
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is...
August 1, 2017
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a...
December 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...
September 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
June 1, 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
A description is not available for this item.
October 1, 2002
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for...

References

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