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IPC-2141

Design Guide for High-Speed Controlled Impedance Circuit Boards

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Organization: IPC
Publication Date: 1 March 2004
Status: active
Page Count: 4

Document History

IPC-2141
March 1, 2004
Design Guide for High-Speed Controlled Impedance Circuit Boards
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each other’s area. The...
IPC-2141
March 1, 2004
Design Guide for High-Speed Controlled Impedance Circuit Boards
A description is not available for this item.
IPC-2141
April 1, 1996
Controlled Impedance Circuit Boards and High Speed Logic Design
A description is not available for this item.

References

This document references:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
This document references:
IPC-TM-650 2.5.5.7 - Characteristic Impedance of Lines on Printed Boards by TDR
Published by IPC on March 1, 2004
This document describes time domain reflectometry (TDR) methods for measuring and calculating the characteristic impedance, Z(0), of a transmission line on a printed circuit board (PCB). In TDR, a...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-TM-650 2.5.5.7 - Characteristic Impedance of Lines on Printed Boards by TDR
Published by IPC on March 1, 2004
This document describes time domain reflectometry (TDR) methods for measuring and calculating the characteristic impedance, Z(0), of a transmission line on a printed circuit board (PCB). In TDR, a...
This document references:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
This document references:
IPC-D-356 - Bare Substrate Electrical Test Data Format
Published by IPC on October 1, 2002
SCOPE AND OBJECTIVE This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and...
This document is referenced by:
IEC TR 63017 - Flexible printed circuit boards (FPCBs) – Method of compensation of impedance variations
Published by IEC on December 1, 2015
This Technical Report specifies a compensation method of Cu linewidth according to impeadance reduction by using noise suppression materials (hereafter referred to as NSMs) for FPCBs. This Technical...
This document is referenced by:
IPC-HDBK-001 - Handbook and Guide to Supplement J-STD-001
Published by IPC on January 1, 2021
This Handbook is a companion reference to the J-STD-001 (standard) and is intended to provide supporting information. Additional detailed information can be found in documents referenced within the...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document is referenced by:
IPC-6018 - Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Published by IPC on July 1, 2016
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the...
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