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IEEE MOBILE HDBK - THE MOBILE COMMUNICATIONS HANDBOOK
IEEE
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MEMS: Fundamental Technology and Applications
June 5, 2013 - CRC

The microelectromechanical systems (MEMS) industry has experienced explosive growth over the last decade. Applications range from accelerometers and gyroscopes used in automotive safety to high-precision on-chip integrated oscillators for reference generation and mobile phones....

MEMS Packaging
January 1, 2004 - IET

The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in...

CEI EN 62047-5 - Semiconductor devices - Micro-electromechanical devices Part 5: RF MEMS switches
April 1, 2015 - CEI

This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency)...

DS/EN 62047-5 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
October 3, 2011 - DS

This part of IEC 62047 describes terminology, definition, symbols, test methods that can be used to evaluate and determine the essential ratings and characteristic parameters of RF MEMS switches. The statements made in this standardization are also applicable to RF (Radio Frequency)...

Biomaterials for MEMS
March 31, 2011 - CRC

This book serves as a guide for practicing engineers, researchers, and students interested in MEMS devices that use biomaterials and biomedical applications. It is also suitable for engineers and researchers interested in MEMS and its applications but who do not have the...

Advanced MEMS Packaging
January 1, 2010 - MCGRAW

A comprehensive guide to advanced MEMS packaging methods. This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves...

MEMS and Mechanics
July 23, 2013 - TTP

Collection of selected, peer reviewed papers from the 2013 International Conference on MEMS and Mechanics (MEMSM 2013), March 15-16, 2013, Wuhan, China. The papers are grouped as follows: Chapter 1: Materials Science, Processing, Technology and Engineering; Chapter 2: MEMS and...

Microsensors MEMS and Smart Devices
January 1, 2000 - WILEY

Microsensors and MEMS (micro-electro-mechanical systems) are revolutionising the semiconductor industry. A microsystem or the so-called "system-on-a-chip" combines microelectronic circuitry with microsensors and microactuators. This emergent field has seen the development of applications...

Optical MEMS, Nanophotonics, and Their Applications
December 15, 2017 - CRC

This book covers device design fundamentals and system applications in optical MEMS and nanophotonics. Expert authors showcase examples of how fusion of nanoelectromechanical (NEMS) with nanophotonic elements is creating powerful new photonic devices and systems including...

Silicon Wet Bulk Micromachining for MEMS
April 7, 2017 - CRC

Summary Micro electro mechanical systems (MEMS)-based sensors and actuators have become remarkably popular in the past few decades. Rapid advances have taken place in terms of both technologies and techniques of fabrication of MEMS structures. Wet chemical-based silicon bulk...

Photonic MEMS Devices: Design, Fabrication and Control
September 4, 2008 - CRC

Photonic MEMS devices represent the next major breakthrough in the silicon revolution. While many quality resources exist on the optic and photonic aspect of device physics, today's researchers are in need of a reference that goes beyond to include all aspects of engineering...

RF MEMS: Theory Design and Technology
January 1, 2002 - WILEY

Practical and theoretical coverage of RF MEMS for circuits and devices New RF and microwave frequency MEMS (microelectromechanical systems) have potentially enormous and widespread applications in the telecommunications industry. Components based on this technology-such as...

MEMS and MOEMS Technology and Applications
January 1, 2000 - SPIE

Cost, size, speed, weight, and precision are driving the miniaturization of mechanical systems. This book presents a detailed look at two micromachining technologies that have evolved from the integrated circuits industry: MEMS (micro-electromechanical systems) and MOEMS (micro systems with...

SEMI MS3 - TERMINOLOGY FOR MEMS TECHNOLOGY
SEMI
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DS/EN 62047-4 - Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
November 5, 2010 - DS

IEC 62047-4:2008 describes the generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical...

IEC 62047-32 - Semiconductor devices – Micro-electromechanical devices – Part 32: Test method for the nonlinear vibration of MEMS resonators
January 1, 2019 - IEC

This part of IEC 62047 specifies the test method and test condition for the nonlinear vibration of MEMS resonators. The statements made in this document apply to the development and manufacture for MEMS resonators.

Smart Material Systems and MEMS: Design and Development Methodologies
January 1, 2006 - WILEY

Smart technology is a progressive field that is currently being used to address many challenges in aerospace, automotive, civil, mechanical, biomedical and communication engineering disciplines. Influenced by biological systems, smart materials are often attached to or embedded into structural...

IEC 62047-31 - Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
April 1, 2019 - IEC

This part of IEC 62047 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many...

IEC 62047-33 - Semiconductor devices – Micro-electromechanical devices – Part 33: MEMS piezoresistive pressure-sensitive device
April 1, 2019 - IEC

This part of IEC 62047 defines terms, definitions, essential ratings and characteristics, as well as test methods applicable to MEMS piezoresistive pressure-sensitive device. This document applies to piezoresistive pressure-sensitive devices for automotive, medical treatment,...

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