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MIL-C-47009 - COMPOUND, SILICONE, HEAT SINK
NPFC
A description is not available for this item.
MIL-H-87111 - HEAT SINK, SEMICONDUCTOR DEVICES
NPFC
A description is not available for this item.
MIL-PRF-47009 - COMPOUND, SILICONE, HEAT SINK
NPFC
A description is not available for this item.
SAE AIR1957 - (R) Heat Sinks for Airborne Vehicles
November 1, 2015 - SAE

This document summarizes types of heat sinks and considerations in relation to the general requirements of aircraft heat sources, and it provides information to achieve efficient utilization and management of these heat sinks. In this document, a heat...

ANS 2.21 - Criteria for Assessing Atmospheric Effects on the Ultimate Heat Sink
January 1, 2012 - ANS

This standard describes atmospheric effects for consideration when designing ultimate heat sinks for safety-related systems at nuclear power units. Required analyses are provided for a meteorological assessment of the ultimate heat sink to ensure that design temperatures...

NAS4117 - HEAT SINK, INSULATOR, WAFER TYPE
August 31, 2012 - AIA/NAS
A description is not available for this item.
NRC RG 1.27 - ULTIMATE HEAT SINK FOR NUCLEAR POWER PLANTS
NRC/NUC
A description is not available for this item.
DESC-DWG-85136 - HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINUM ALLOY
February 23, 2010 - DOD

This drawing describes the requirements for a family of aluminum alloy fin stock heat sinks for use with electronic components.

DESC-DWG-84002 - HEAT SINKS FOR SEMICONDUCTOR DEVICES
March 26, 2018 - DOD
A description is not available for this item.
NAS4122 - HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, EXTRUDED
January 31, 2013 - AIA/NAS
A description is not available for this item.
NAS4118 - HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, RETAINER CLIP TYPE
September 28, 2012 - AIA/NAS
A description is not available for this item.
NAS4124 - HEAT SINK, ELECTRICAL/ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, DUAL LINK
August 31, 2012 - AIA/NAS
A description is not available for this item.
NAS4121 - HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
January 27, 2012 - AIA/NAS
A description is not available for this item.
NAS4119 - HEAT SINK, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, PRESS-ON TYPE
June 30, 2011 - AIA/NAS
A description is not available for this item.
SAE AIR1934 - Use of Structural Carbon Heat Sink Brakes on Aircraft
May 1, 1996 - SAE

The purpose of this document is to relate areas where carbon brake technology may differ from traditional steel brake technology in design and performance Carbon brakes have been used in military aircraft for many years and are now frequently used on newly commercial development aircraft This...

MIL-DTL-47113 - COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
NPFC
A description is not available for this item.
A-A-56022 - COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
NPFC
A description is not available for this item.
MIL-C-47113 - COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
NPFC
A description is not available for this item.
DOD-STD-35-115 - HEAT SINKS, AUTOMATED ENGINEERING DOCUMENT PREPARATION SYSTEM
NPFC
A description is not available for this item.
MIL-H-87111/6 - HEAT SINKS, SEMICONDUCTOR DEVICES, CLASS 1 (EXTRUDED)
NPFC
A description is not available for this item.
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