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Scope and object This standard is applicable to dependent specified time electrical measuring relays which protect equipment from electrical thermal damage by the measurement of current flowing in the protected equipment. This standard covers the following two types of relays: a)...
Applies to dependent specified time relays which protect equipment, including motors, from electrical thermal damage. To be read in conjunction with BS EN 60255
Provides a method of thermal performance evaluation for empty indoor enclosures according to EN 60917 and EN 60297, and, for outdoor enclosures according to EN 61969. Provides criteria to determine the thermal absorption factors relating to principles of enclosure design; internal...
This International Standard provides a method of thermal performance evaluation for empty indoor enclosures according to IEC 60917 and IEC 60297, and, for outdoor enclosures according to IEC 61969. This standard contains criteria to determine the thermal absorption factors relating to...
This part of the IEC 60255 series specifies minimum requirements for thermal protection relays. This standard includes specification of the protection function, measurement characteristics and test methodologies. The object of this standard is to establish a common and reproducible reference...
IEC 60255-149:2013 specifies minimum requirements for thermal protection relays. This standard includes specification of the protection function, measurement characteristics and test methodologies. The object is to establish a common and reproducible reference for evaluating dependent time...
This part of the IEC 60255 series specifies minimum requirements for thermal protection relays. This standard includes specification of the protection function, measurement characteristics and test methodologies. The object of this standard is to establish a common and reproducible reference...
The purpose of this test method is to measure the thermal impedance of the MOSFET under the specified conditions of applied voltage, current and pulse duration. The temperature sensitivity if the forward voltage drop of the source-drain is used as the junction temperature indicator. This...
The purpose of this test method is to measure the thermal impedance of the Bipolar Transistor under the specified conditions of applied voltage, current and pulse duration. The temperature sensitivity of the base-emitter voltage is used as the junction temperature indicator. This test method...
This part of IEC 62951 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The...
This specification covers the properties and requirements for round, copper-coated 42 % nickel-iron wire, commonly known as dumet, intended primarily for sealing to soft glass. The wires shall conform to requirements stated for chemical composition, oxide coatings, dimension, internal and surface...
This test method will permit the user to make comparisons of image quality and machine performance for thermal paper. This test method is not intended for manufacturing control testing. This test method is designed to test only thermal papers designed for use with facsimile machines....
This test method covers a standardized procedure utilizing the facsimile thermal printer as an imaging device for measuring the performance properties of direct thermal paper. This test method may also be used to evaluate some imaging properties of facsimile printers. This standard...
1.1 This test method covers a standardized procedure utilizing the facsimile thermal printer as an imaging device for measuring the performance properties of direct thermal paper. 1.2 This test method may also be used to evaluate some imaging properties of facsimile printers. 1.3 This...
1.1 This test method covers a standardized procedure utilizing the facsimile thermal printer as an imaging device for measuring the performance properties of direct thermal paper. 1.2 This test method may also be used to evaluate some imaging properties of facsimile printers. 1.3 This...
Requirements concerning the testing of the combination of ballast and thermal protectors are given in CAN/CSA-E61347-1 and CSA C22.2 No. 74. This Standard applies to the safety of such equipment designed and constructed for installation and use in accordance with CSA C22.1, Canadian...
1.1 This test method covers a standardized procedure utilizing the facsimile thermal printer as an imaging device for measuring the performance properties of direct thermal paper. 1.2 This test method may also be used to evaluate some imaging properties of facsimile printers. 1.3 This...
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers; - singulated bare die; - die and wafers with attached connection structures; - minimally or partially encapsulated die and wafers. This part of IEC 62258...
This specification covers the properties and requirements for round, copper-coated 42 % nickel-iron wire, commonly known as dumet, intended primarily for sealing to soft glass. The wires shall conform to requirements stated for chemical composition, oxide coatings, dimension, internal and surface...
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers. This part of IEC 62258...
