Find the standard you are looking for at Engineering360. Documents are available for purchase from the IHS Standards Store.

1 - 20 of 59 results

CRC - KE20544 - ADHESION ASPECTS OF THIN FILMS, VOLUME 2 : ADHESION ASPECTS OF THIN FILMS, VOLUME 2 Organization: CRC
Date: 2005-05-06
Description: The topics covered include: Factors influencing adhesion of thin films; relevance of stresses in film adhesion; surface effects on intrinsic thin film stresses; adhesion improvement; hemocompatibility of DLC coatings; thin films of various materials on a host of substrates; thin polymer films; surface modification of polymers; adhesion of metal films on polymers; investigation of metal-polymer interactions; adhesion measurement; scratch test; microscratch test; and abrasion and durability of thin films.
CRC - DKE2964 - ENGINEERING THIN FILMS AND NANOSTRUCTURES WITH ION BEAMS Organization: CRC
Date: 2005-04-06
Description: Featuring internationally recognized researchers, the book compiles their expertise in a multidimensional source that: Highlights the mechanisms and visual evidence of the effects of single-ion impacts on metallic surfaces Considers how ion-beam techniques can help achieve higher disk-drive densities Introduces gas-cluster ion-beam technology and reviews its precedents Explains how ion beams are used to aggregate metals and semiconductors into nanoclusters with nonlinear optical properties Addresses current challenges in building equipment needed to produce nanostructures in an industrial setting Examines the combination of ion-beam techniques, particularly with physical vapor deposition Delineates the fabrication of nanopillars, nanoflowers, and interconnected nanochannels in three dimensions by using atomic shadowing techniques Illustrates the production of nanopores of varying dimensions in polymer films, alloys, and superconductors using ion-beam irradiation Shows how fingerprints can be made more reliable as forensic evidence by recoil-mixing them into the substrate using ion beams From the basics of the ion-beam modification of materials to state-of-the-art applications, Engineering Thin Films and Nanostructures with Ion Beams is a comprehensive text that provides a complete retrospective of the technology and illustrates the wider landscape for which ion beam techniques are becoming increasingly applicable.
DS/EN 62047-2 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS Organization: DS
Date: 2006-12-19
Description: This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 ìm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
IEC 62047-2 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 2: TENSILE TESTING METHOD OF THIN FILM MATERIALS - EDITION 1.0 Organization: IEC
Date: 2006-08-01
Description: This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.
CENELEC - EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS Organization: CENELEC
Date: 2010-03-01
Description: This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm under constant force range or constant displacement range.
DS/EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: DS
Date: 2013-10-08
Description: IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre.
DS/EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS Organization: DS
Date: 2010-04-09
Description: IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range.
CENELEC - EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: CENELEC
Date: 2013-09-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
IEC 62047-18 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS - EDITION 1.0 Organization: IEC
Date: 2013-07-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
CEI EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS Organization: CEI
Date: 2014-04-01
Description: This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm.
DIN EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS (IEC 47F/76/CD:2011) Organization: DIN
Date: 2011-06-01
Description: This international standard specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0.1 μm and 10 μm.
CENELEC - EN 62047-3 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING Organization: CENELEC
Date: 2006-09-01
Description: This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
IEC 62047-3 - SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES – PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING - EDITION 1.0 Organization: IEC
Date: 2006-08-01
Description: This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
DS/EN 62047-3 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING Organization: DS
Date: 2006-12-19
Description: This International Standard specifies a standard test piece, which is used to guarantee thepropriety and accuracy of a tensile testing system for thin film materials with length and widthunder 1 mm and thickness under 10 µm, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices.
UL 61646 - UL STANDARD FOR SAFETY THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES – DESIGN QUALIFICATION AND TYPE APPROVAL - FIRST EDITION Organization: UL
Date: 2012-01-25
Description: Scope and object This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
CEI EN 61646 - THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES - DESIGN QUALIFICATION AND TYPE APPROVAL Organization: CEI
Date: 2012-10-01
Description: Scope and object This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
DS/EN 61646 - THIN-FILM TERRESTRIAL PHOTOVOLTAIC (PV) MODULES – DESIGN QUALIFICATION AND TYPE APPROVAL Organization: DS
Date: 2008-10-31
Description: This International Standard lays down requirements for the design qualification and type approval of terrestrial, thin-film photovoltaic modules suitable for long-term operation in general open-air climates as defined in IEC 60721-2-1.
WSPC - PHYS TECH THN FILMS IWTF 2003 - PHYSICS AND TECHNOLOGY OF THIN FILMS, IWTF 2003 PROCEEDINGS OF THE INTERNATIONAL WORKSHOP Organization: WSPC
Date: 2004-06-08
Description: Thin films science and technology plays an important role in the high-tech industries. Thin film technology has been developed primarily for the need of the integrated circuit industry.
TTP - ADVANCES ON MATERIALS ENG - ADVANCES ON MATERIALS ENGINEERING Organization: TTP
Date: 2013-11-07
Description: The 46 papers are grouped as follows: Chapter 1: Reinforced Materials, Structural Materials and Engineering; Chapter 2: Concrete and Cement, Mortars; Chapter 3: Materials Processing Technology; Chapter 4: Energy, Electric and Optics Materials; Chapter 5: Nanomaterials and Nanotechnologies; Chapter 6: Bio- and Environment Materials; Chapter 7: Thin Films; Chapter 8: Polymers, Alloys and Other Materials Technologies.
TTP - KEY ENGE MATE III - KEY ENGINEERING MATERIALS III Organization: TTP
Date: 2013-07-13
Description: The 85 papers are grouped as follows: Chapter 1: Novel Composite Materials and their Characterization; Chapter 2: Advances in Materials Technology; Chapter 3: Developments in Magnetic Materials, Electrical Composites, Thin Films and ZnO Technology; Chapter 4: More Studies on Nano Materials, Nano Composites and Nano Technology; Chapter 5: Developments in Biocomposites, Bioethanol and Green Materials; Chapter 6: Lightweight Foamed Concrete, Foamed Greencrete, Cement Syntactic Foam; Chapter 7: Chemical Engineering, Corrosion, Geochemistry and Geotextile; Chapter 8: Advances in Manufacturing Techniques; Chapter 9: Wastewater Treatment and Biotechnology; Chapter 10: Analysis of Composite Structures and Other Miscellaneous Researches.

1 - 20 of 59 results